Senior Physical Design Engineer - FinFET RTL to GDSII Lead, Grenoble
Senior Physical Design Engineer - FinFET RTL to GDSII Lead, Grenoble
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Grenoble, France
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Publiée: il y a une semaine
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Description
ASIC Verification | Physical Design Contracts
IC Resources is working with a client in Grenoble , looking for an engineer on a 12-month contract where you will be
working onsite.
As a Senior Staff Physical Design Engineer, you will provide technical leadership for the physical implementation of next-generation, high-performance SoCs . This role focuses on advanced technology nodes, specifically 16nm FinFET and below, driving designs from RTL to final GDSII . You will be a technical pillar within the team, responsible for defining implementation strategies, mentoring junior engineers, and ensuring the delivery of market-leading PPA (Power, Performance, Area) targets.
Key responsibilities
End-to-End Implementation:
Lead the full RTL-to-GDSII physical design flow, including synthesis, floorplanning, placement, routing, CTS, and timing closure
FinFET Strategy:
Define and execute optimized implementation strategies tailored for FinFET challenges, such as advanced track patterns, secondary power grids, and complex DRC constraints
Design Closure&Optimization:
Perform Multi-Mode Multi-Corner (MMMC) timing closure and power optimization to meet aggressive PPA targets.
Analysis&Verification:
Conduct comprehensive power integrity analysis (IR drop/EM) and drive physical verification closure (DRC, LVS, ERC, Antenna) using industry-standard sign-off tools
Cross-Functional Collaboration:
Partner with RTL and DFT teams to ensure physically aware synthesis, congestion mitigation, and efficient scan-chain integration
Technical Leadership:
Act as a subject matter expert and mentor, interfacing with foundries and EDA vendors to resolve technology-specific challenges and driving EDA flow automation via Tcl, Python, or Perl
Candidate profile
Education:
Master’s degree in Electrical Engineering or a related technical field
Professional Experience:
10+ years of expertise in full-custom layout for memory and/or analog/mixed-signal IPs
Technical Mastery:
Deep knowledge of physical constraints, including matching, EM, IR drop, and antenna rules
Tool Proficiency:
Expert-level command of layout and sign-off tools (e.g., Virtuoso, Calibre); proficiency in CAD scripting is highly valued
Advanced Expertise (Pluses):
Experience with emerging memories (MRAM, RRAM), in-memory computing layout, and advanced CMOS nodes
Soft Skills:
A self-directed and organized professional with excellent communication skills, capable of engaging effectively with internal stakeholders and external partners. Fluency in English is required; knowledge of French or Dutch is a bonus
#J-18808-Ljbffr
IC Resources is working with a client in Grenoble , looking for an engineer on a 12-month contract where you will be
working onsite.
As a Senior Staff Physical Design Engineer, you will provide technical leadership for the physical implementation of next-generation, high-performance SoCs . This role focuses on advanced technology nodes, specifically 16nm FinFET and below, driving designs from RTL to final GDSII . You will be a technical pillar within the team, responsible for defining implementation strategies, mentoring junior engineers, and ensuring the delivery of market-leading PPA (Power, Performance, Area) targets.
Key responsibilities
End-to-End Implementation:
Lead the full RTL-to-GDSII physical design flow, including synthesis, floorplanning, placement, routing, CTS, and timing closure
FinFET Strategy:
Define and execute optimized implementation strategies tailored for FinFET challenges, such as advanced track patterns, secondary power grids, and complex DRC constraints
Design Closure&Optimization:
Perform Multi-Mode Multi-Corner (MMMC) timing closure and power optimization to meet aggressive PPA targets.
Analysis&Verification:
Conduct comprehensive power integrity analysis (IR drop/EM) and drive physical verification closure (DRC, LVS, ERC, Antenna) using industry-standard sign-off tools
Cross-Functional Collaboration:
Partner with RTL and DFT teams to ensure physically aware synthesis, congestion mitigation, and efficient scan-chain integration
Technical Leadership:
Act as a subject matter expert and mentor, interfacing with foundries and EDA vendors to resolve technology-specific challenges and driving EDA flow automation via Tcl, Python, or Perl
Candidate profile
Education:
Master’s degree in Electrical Engineering or a related technical field
Professional Experience:
10+ years of expertise in full-custom layout for memory and/or analog/mixed-signal IPs
Technical Mastery:
Deep knowledge of physical constraints, including matching, EM, IR drop, and antenna rules
Tool Proficiency:
Expert-level command of layout and sign-off tools (e.g., Virtuoso, Calibre); proficiency in CAD scripting is highly valued
Advanced Expertise (Pluses):
Experience with emerging memories (MRAM, RRAM), in-memory computing layout, and advanced CMOS nodes
Soft Skills:
A self-directed and organized professional with excellent communication skills, capable of engaging effectively with internal stakeholders and external partners. Fluency in English is required; knowledge of French or Dutch is a bonus
#J-18808-Ljbffr
Informations clefs
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Nom de l’entrepriseIC Resources
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Titre de posteSenior Physical Design Engineer - FinFET RTL to GDSII Lead
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Senior Physical Design Engineer - FinFET RTL to GDSII Lead est visible sur Locanto dans la catégorie Grenoble Design, Conception.
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